Plasma-enhanced chemical vapor deposition system
To grow aligned carbon nanotubes, we use plasma-enhanced chemical vapor deposition (PECVD). First nickel is sputter deposited onto a tungsten ribbon. The nickel coating is a catalyst for the growth of CNTs. The nickel is then etched in ammonia (NH3) and argon (Ar) plasma at a pressure around 8 Torr (~1100 Pa or 0.01 atmosphere). After etching, acetylene (C2H2) is added to grow CNTs. During the growth of the CNTs, a electric field is applied so that the CNTs grow vertically. The resulting CNTs are 200nm diameter and 10um long.
To grow aligned carbon nanotubes, we use plasma-enhanced chemical vapor deposition (PECVD). First nickel is sputter deposited onto a tungsten ribbon. The nickel coating is a catalyst for the growth of CNTs. The nickel is then etched in ammonia (NH3) and argon (Ar) plasma at a pressure around 8 Torr (~1100 Pa or 0.01 atmosphere). After etching, acetylene (C2H2) is added to grow CNTs. During the growth of the CNTs, a electric field is applied so that the CNTs grow vertically. The resulting CNTs are 200nm diameter and 10um long.
Magnetron sputtering system
By using magnetron sputtering deposition, we have been able to consistently create thin film coatings on carbon nanotubes. We can deposit metals, oxides and other coatings to functionalize the nanotubes.
By using magnetron sputtering deposition, we have been able to consistently create thin film coatings on carbon nanotubes. We can deposit metals, oxides and other coatings to functionalize the nanotubes.
Electron emission characterization chamber
This system is used to characterize the electron emission properties of emitters and cathodes, and to measure materials properties such as work function.
This system is used to characterize the electron emission properties of emitters and cathodes, and to measure materials properties such as work function.
Cathode performance in plasma discharge environment
To test the characteristics of various emitters in a plasma environment, we have created a plasma discharge simulator. Various plasma conditions, such as gas pressure, current or plasma density, etc can be controlled and emulated in this simulator, thus allows testing and characterization of cathode performance in a plasma discharge environment.
To test the characteristics of various emitters in a plasma environment, we have created a plasma discharge simulator. Various plasma conditions, such as gas pressure, current or plasma density, etc can be controlled and emulated in this simulator, thus allows testing and characterization of cathode performance in a plasma discharge environment.